COG is an acronym for "Chip On Glass", i.e. chip is directly bonded to glass by an ACF (Anisotropic Conductive Film). This installation method can greatly reduce the volume of the entire LCD module, and lower cost than TAB method, and easy mass production, suitable for consumer electronic products with LCD, such as: mobile phone, PDA, MP3 and other portable electronic products. This installation mode is promoted by IC manufacturers, and is the main connection mode between IC and LCD today.
COB is the abbreviation of the English "Chip On Board", that is, the chips are bonded on the PCB, which can greatly reduce the volume of modules, and also reduce the cost in terms of price. As IC manufacturers are reducing the output of QFP (SMT IC with feet on all sides) packages in the production of LCD controls and related chips, the traditional SMT mode will be gradually replaced in future products.
